Research Associate (Mechanical Engineering) and 1 Other Post in DRDO via Walk-in-Interview
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 26/07/2023 |
Date of Interview | 25/07/2023, 26/07/2023 |
Application Opening Date | 25/07/2023 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Offline |
Age Limit | 18-35 |
Qualification Required | Doctorate, Graduate |
Total Vacancies | 3 |
Advertisement Number | TBRL/RA/02/2023 |
Location of Posting/Admission | Chandigarh District, Chandigarh, India, 160022 |
Organisation Type | Non-Educational Institution |
Place of Posting/Admission | Chandigarh, India |
Website | https://www.drdo.gov.in/ |
Department/Subject | Mechanical Engineering, Physic |
Age Relaxation Type | SC/ST, Other Backward Class |
Salary | 54000 |
Work Experience | Yes |
Interview | Yes |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Defence Research and Development Organisation invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Research Associate (Mechanical Engineering)
Essential Qualification: Ph.D or equivalent degree in Mechanical Engineering Or M.Tech/M.E in Mechanical Engineering and 03 (Three) years of experience in Research Teaching or Design and Development with publication of at least on paper in Science Citation Indexed (SCI) Journal.
Post Name: Research Associate (Physics)
Essential Qualification: Ph.D or equivalent Degree in Physics OR Post Graduation in Physics and 03 years or experience in Research, Teaching or Design and Development with publication of at least one paper in Science Citation Indexed (SCI) Journal.
Place of Interview: Terminal Ballistics Research Lab (TBRL), Sector 30 Chandigarh
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.