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  • Young Professional-I Post in ICAR IARI via Walk-in-Interview

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
18/01/2023
Application Closing Date
12/01/2023
Application Opening Date
07/01/2023

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Offline
Age Limit
18-35
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Salary
25000
Post Type
Contractual
Interview
Yes
Place of Posting/Admission
New Delhi, Delhi, India
Age Relaxation Type
SC/ST, Woman, Other Backward Class
Organisation Type
Educational Institution
Website
https://www.iari.res.in/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Young Professional-I

Important Updates

Refer to the official notification for more details.

Application Summary

ICAR Indian Agricultural Research Institute has released a notification for the Young Professional-I post. Interested candidates can apply from 07/01/2023 to 12/01/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

ICAR Indian Agricultural Research Institute invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name: Young Professional-I

Essential Qualification: Bachelors degree in Botany/Agriculture from recognized university/ College.

Desirable: Masters Degree in Plant Pathology. Knowledge of computers, data handling and exposure to statistical analysis.

Place of Interview: Division of Genetics, IARI, New Delhi 110012.

Address to send the application: The Candidate must fill in the application form and send it to Assistant Administrative Officer Division of Genetics, ICAR-Indian Agricultural Research Institute New Delhi-110012 along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.