Junior Research Fellow Post in NIT Durgapur via Direct Recruitment
Event Status : Shortlisted Candidates List Released for Interview
Timeline
Important Dates
Date of Interview | 10/07/2023 |
Application Closing Date | 23/06/2023 |
Application Opening Date | 01/06/2023 |
Other Important Information
Appointment Type | Direct Recruitment, Examination, Research Fellowship |
Application Submission Method | Offline |
Qualification Required | Postgraduate, Graduate |
Total Vacancies | 1 |
Advertisement Number | NITD/EE/JRF/IEMUGV/04/2023 |
Location of Posting/Admission | Paschim Bardhaman District, West Bengal, India, 713432 |
Exam | CSIR NET, GATE, UGC NET |
Place of Posting/Admission | Durgapur, West Bengal, India |
Organisation Type | Educational Institution |
Website | https://nitdgp.ac.in/ |
Post Type | Contractual |
Department/Subject | 01/06/2023 |
Interview | Yes |
Salary | 31000 |
Work Experience | Yes |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Technology Durgapur invites applications for the following posts via direct recruitment:
Post Name: Junior Research Fellow
Essential Qualification:
M.E/M.Tech in Electrical Engineering (EE)/ Electrical and Electronics Engineering (EEE) with minimum CGPA 6.5 or 65% marks from any recognized Institute/University.
B.E/B. Tech in EE/EEE with valid NET/GATE score and with minimum 7.5 CGPA or 70% marks from any recognized Institute/ University
Address to send the application: The Candidate must fill in the application form and send it to Dr. Jayati Dey Dr. Tapas Kumar Saha Principal Investigator& Associate Professor Co-Investigator& Professor Department of Electrical Engineering Department of Electrical Engineering NIT Durgapur, Durgapur 713209 along with relevant documents.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.