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  • Research Associate Post in IIT Hyderabad via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
21/08/2023
Application Opening Date
07/08/2023

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Age Limit
18-32
Qualification Required
Graduate
Total Vacancies
8
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Website
https://iith.ac.in/
Place of Posting/Admission
Hyderabad, Telangana, India
Organisation Type
Educational Institution
Post Type
Contractual
Salary
25000
Work Experience
Yes
Interview
Yes
Department/Subject
Computer Science and Engineering

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Associate

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Technology Hyderabad has released a notification for the Research Associate post. Interested candidates can apply from 07/08/2023 to 21/08/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Technology Hyderabad invites applications for the following posts via direct recruitment:

Post Name: Research Associate

Essential Qualification:

  1. Bachelors degree in Computer Science and Engineering/Artificial Intelligence/Mathematics and Computing/ECE (or any related discipline) with at least 70% marks.

  2. Fluency in English writing and technical communication.

Desirable Experience:

  1. Completed coursework in machine learning and deep learning

  2. Knowledge of programming in Python and PyTorch/Tensorflow

  3. Candidate with relevant experience and publications in relevant conferences/journals will have added advantage.

Application send via email to vineethnb@cse.iith.ac.in

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.