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  • Guest Faculty Post in SLIET Via Walk-In-Interview

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
10/07/2024, 11/07/2024, 12/07/2024
Application Closing Date
12/07/2024
Application Opening Date
10/07/2024

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Offline
Qualification Required
Graduate, Postgraduate, Doctorate
Advertisement Number
03/2024
Location of Posting/Admission
Sangrur District, Punjab, India, 148021
Department/Subject
Chemical Engineering, Chemistry, Civil Engineering, Computer Science and Engineering, Electrical and Instrumentation Engineering, Electronics and Communication Engineering, Food Engineering and Technology, Management and Humanities, English, Mathematic, Mechanical Engineering, Physic
Salary
40000
Post Type
Contractual
Interview
Yes
Website
http://administration.sliet.ac.in/
Work Experience
Yes
Organisation Type
Educational Institution
Place of Posting/Admission
Longowal, Punjab, India

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Guest Faculty

Important Updates

Refer to the official notification for more details.

Application Summary

Sant Longowal Institute of Engineering and Technology has released a notification for the Guest Faculty post. Interested candidates can apply from 10/07/2024 to 12/07/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Sant Longowal Institute of Engineering and Technology invites applications for Guest Faculty post.

Application & Interview Details: To apply, You need to carry the necessary documents with you on the date of interview.

Last Date of Interview: 12/07/2024

Place of Interview: Sant Longowal Institute of Engineering and Technology, Longowal, Distt. Sangrur, Punjab- 148106.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting, etc. refer to the given details and attachments below