Senior Research Fellow and 1 Other Post in NIT Delhi via Walk-In-Interview
Event Status : Created Event
Timeline
Important Dates
Date of Interview | 12/01/2023 |
Application Closing Date | 11/01/2023 |
Application Opening Date | 06/01/2023 |
Other Important Information
Appointment Type | Walk-In-Interview, Examination, Research Fellowship |
Application Submission Method | Online |
Qualification Required | Postgraduate, Graduate, Doctorate |
Total Vacancies | 2 |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Exam | CSIR NET, GATE, UGC NET |
Interview | Yes |
Post Type | Contractual |
Work Experience | Yes |
Age Relaxation Type | SC/ST, Other Backward Class, Person with Benchmark Disabilities |
Organisation Type | Educational Institution |
Website | https://nitdelhi.ac.in/ |
Place of Posting/Admission | New Delhi, Delhi, India |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Technology Delhi invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Senior Research Fellow
Essential Qualification: Post graduation in Sciences (Physics or optics)/ Graduation or post graduation in Engineering qualified with GATE/NET/JRF/National level examination.
Post Name: Research Associate
Essential Qualification: Ph.D. degree in Sciences/ Engineering/ M.E./ M.Tech. with 3 years of research, or design and development of optical instruments.
Desirable: Candidates must have an experience in holography. Candidates from other branch may also apply if they have hands-on experience in holography/ designing and development of the optical instrument/ hands-on experience in Machine learning/ artificial intelligence will be preferred.
Application send via email to gsheoran@nitdelhi.ac.in
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.