Master of Technology Programme in IIT Delhi for the Academic Session 2023-24
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 30/06/2023 |
Application Opening Date | 20/05/2023 |
Other Important Information
Admission Bases | Course Admission |
Qualification Required | Graduate, Postgraduate |
Stream | Engineering, Science |
Application Fee | Yes |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Educational Credential Awarded | Degree |
Organisation Type | Educational Institution |
Website | https://home.iitd.ac.in/ |
Place of Posting/Admission | New Delhi, Delhi, India |
Department/Subject | Smart Material and Technology, Mathematics and Computing, Computer Science and Engineering, Computer Science and Engineering Analytics, Electrical Engineering, Electronics and Communication Engineering, Mechanical Engineering, Power Electronics and Drives, Power and Energy System, CAD/CAM |
Application Link | https://forms.gle/175CdKz99Rxvhudk6. |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Courses Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Technology Delhi invites online applications from eligible candidates for admission in Master of Technology programme. The important details of the admission process are listed below -
Course name: Master of Technology
Educational Qualification:
Admission shall be open to Indian nationals who have passed the prescribed qualifying examination with a Cumulative Grade Point Average (CGPA) of at least 6.5 in the 0-10 scale grading system, OR not less than 60% marks in the aggregate (taking into account the marks scored in all the subjects of all the public/university examinations conducted during the entire prescribed period for the degree Program)
MSc /BE/ BTech/ BSc/MCA Passed from various Disciplines
For more details related to eligibility criteria, syllabus, fee, pattern, annexures, etc refer to the attachments below.