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  • Faculty Post in PEC Chandigarh via Walk-in-Interview

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
24/07/2023
Date of Interview
17/07/2023, 18/07/2023, 19/07/2023, 20/07/2023, 21/07/2023, 22/07/2023, 24/07/2023
Application Opening Date
17/07/2023

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Offline
Qualification Required
Graduate, Postgraduate, Doctorate
Location of Posting/Admission
Sahibzada Ajit Singh Nagar District, Punjab, India, 140308
Place of Posting/Admission
Chandigarh, Punjab, India
Organisation Type
Educational Institution
Website
https://pec.ac.in/
Post Type
Contractual
Department/Subject
Aerospace Engineering, Centre of Management and Humanities, Chemistry, Computer Science and Engineering, Data Science, Cyber Security Research Centre, Electrical Engineering, Electronics and Communication Engineering, Metallurgical and Material Engineering, Mechanical Engineering, Production and Industrial Engineering, Mathematic, Physic, Civil Engineering
Interview
Yes
Salary
73500, 67500

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Faculty

Important Updates

Refer to the official notification for more details.

Application Summary

Punjab Engineering College Chandigarh has released a notification for the Faculty post. Interested candidates can apply from 17/07/2023 to 24/07/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Punjab Engineering College Chandigarh invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name: Faculty

Essential Qualification: First class Bachelor’s and Master’s Degree with PhD completed/thesis submitted in the relevant discipline.

Place of Interview: Punjab Engineering College Chandigarh

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.