Junior Engineering Assistant and 8 other posts in RFCL
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 24/11/2021 |
Application Opening Date | 04/11/2021 |
Other Important Information
Appointment Type | Direct Recruitment, Examination |
Application Submission Method | Online |
Examination Mode | Online |
Age Limit | 18-35 |
Qualification Required | Graduate, Diploma |
Total Vacancies | 71 |
Advertisement Number | 03 (RFCL)/2021 |
Application Fee | Yes |
Location of Posting/Admission | Peddapalli District, Telangana, India, 505174 |
Place of Posting/Admission | Ramagundam, Telangana, India |
Organisation Type | Non-Educational Institution |
Website | https://www.rfcl.co.in/ |
Group | Group C |
Pay Matrix | W-3, W-6 |
Quota/Reservation | Unreserved, Other Backward Classes, Economically Weaker Sections, Scheduled Castes, Scheduled Tribes, PWBD Quota, Ex-servicemen |
Age Relaxation Type | SC/ST, Other Backward Class, Economically Weaker Section, Person with Benchmark Disabilities |
Department/Subject | Production, Mechanical, Electrical, Chemical Lab, Transport |
Work Experience | Yes |
Examination Centre | Regional |
Salary | 23000, 25000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Ramagundam Fertilizers and Chemicals Limited invites applications for the following posts via direct recruitment:
Post Name:
Junior Engineering Assistant Grade II (Chemical Lab)
Junior Engineering Assistant Grade II (Production)
Engineering Assistant Grade II (Production)
Engineering Assistant Grade II (Mechanical)
Engineering Assistant Grade II (Electrical)
Godown Keeper
Store Assistant Grade II
Assistant Grade III (Transportation)
Office Assistant Grade III
Application can be sent via email to rfcl@onlineregistrationforms.com
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.