Director (Personnel) Post in Electronics Corporation of India Limited via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 22/11/2022 |
Application Opening Date | 22/09/2022 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Composite |
Age Limit | 46-50, 51-55 |
Qualification Required | Postgraduate, Diploma |
Total Vacancies | 1 |
Advertisement Number | 108/2022 |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Interview | Yes |
Work Experience | Yes |
Post Type | Contractual |
Place of Posting/Admission | New Delhi, Delhi, India |
Organisation Type | Non-Educational Institution |
Pay Matrix | Level 14, Grade Pay 10000 |
Salary | 247866 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Important Updates
Refer to the official notification for more details.
Application Summary
Electronics Corporation of India Limited invites applications for the following post via direct recruitment:
Post Name: Directors (Personnel)
Essential Qualification: The applicant should be a graduate with good academic record from a recognized University/Institute. Post Graduate Diploma or Degree in Personnel Management/Human Resource Management or Masters in Business Administration (MBA)/Post Graduate Diploma/Programme in Management (PGDM/PGPM) from a recognized University/Institute will be desirable.
Essential Work Experience: The applicant should have at least five years of cumulative experience during the last ten years in various aspects of HR/ Personnel Management/Industrial Relations in an organization of repute
Address to send the application: Candidate must fill in the application form and send it to Smt Kimbuong Kipgen Secretary, Public Enterprises Selection Board, Public Enterprises Bhawan, BlockNo. 14, CGO Complex, Lodhi Road, New Delhi-110003.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.