Senior Research Fellow/Research Associate Post in IIT Hyderabad via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 25/04/2023 |
Application Opening Date | 13/04/2023 |
Other Important Information
Appointment Type | Direct Recruitment, Research Fellowship |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Postgraduate, Doctorate |
Total Vacancies | 1 |
Location of Posting/Admission | Hyderabad District, Telangana, India, 500028 |
Salary | 35000, 45000 |
Work Experience | Yes |
Website | https://iith.ac.in/ |
Place of Posting/Admission | Hyderabad, Telangana, India |
Organisation Type | Educational Institution |
Department/Subject | Material Science and Metallurgical Engineering |
Interview | Yes |
Post Type | Contractual |
Application Link | https://docs.google.com/forms/d/e/1FAIpQLSe9ilNwR23FW7GEFELjST20s85Ecqcn7MRKRN1vXnf4uyFMcw/viewform? usp=sf_link |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Technology Hyderabad invites applications for the following post via direct recruitment:
Post Name: Senior Research Fellow/Research Associate
Essential Qualification:
For SRF: M Tech/ME or equivalent degree in Metallurgical Engineering/Materials Science/ Ceramics Engineering/ Mechanical Engineering or related areas.
For RA: PhD degree in Metallurgical Engineering/ Materials Science/ Ceramics Engineering/ Mechanical Engineering or related areas.
Desirable:
Experience in some of the following areas: powder metallurgy, sintering, microstructural study, metallography practices, heat treatments, mechanical testing. Experience in working with powders, ceramics, composite materials, fiber handling, etc.
Experience in handling various material characterization, processing and testing equipment, etc.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.