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  • Diploma Programme in MSME TC Bhopal for Academic Year 2024

    इवेंट की स्थिति : Created Event

घटनाक्रम

महत्वपूर्ण तिथियाँ

Result Available
23/07/2024
Exam Date
22/07/2024
Application Closing Date
14/07/2024
Application Opening Date
02/06/2024

अन्य महत्वपूर्ण जानकारी

Admission Bases
Course Admission
Application Submission Method
Offline, Online
Qualification Required
Matriculate
Stream
Others
Application Fee
Yes
Location of Posting/Admission
Bhopal District, Madhya Pradesh, India, 322211
Educational Credential Awarded
Diploma
Place of Posting/Admission
Bhopal, Madhya Pradesh, India
Website
http://msmetcbhopal.org/
Organisation Type
Non-Educational Institution
Age Limit
15-19
Age Relaxation Type
SC/ST
Quota/Reservation
Economically Weaker Sections, Scheduled Tribes, Scheduled Castes, Other Backward Classes, PWBD Quota
Application Link
https://msmetcbhopal.org/Regist-Dipl-2024/

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी किए गए कोर्सेस

1. Advance Diploma in Tool and Die making
2. Diploma in Mechatronics

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

MSME Technology Centre Bhopal has released notifications for the Advance Diploma in Tool and Die making and Diploma in Mechatronics programs. Interested candidates can apply from 02/06/2024 to 14/07/2024. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

MSME Technology Centre Bhopal invites online applications from eligible candidates for admission. The important details of the admission process are listed below -

Application Process: To apply, kindly fill out the provided application form with the necessary documents to the Official Website and address: 

Course Name: Diploma Programme

Last Date for Application: 14/07/2024

Mode of Application: Offline/Online

Address to send the Application: MSME Technology Centre Bhopal

For more details related to eligibility criteria, syllabus, fee, pattern, annexures, etc refer to the attachments below.