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  • Junior Research Fellow Post in TBRL via Walk-In-Interview

    इवेंट की स्थिति : Created Event

घटनाक्रम

महत्वपूर्ण तिथियाँ

Application Closing Date
28/04/2023
Date of Interview
25/04/2023, 26/04/2023, 27/04/2023, 28/04/2023
Application Opening Date
25/04/2023

अन्य महत्वपूर्ण जानकारी

Appointment Type
Walk-In-Interview, Research Fellowship, Examination
Application Submission Method
Offline
Age Limit
18-27
Qualification Required
Graduate, Postgraduate
Total Vacancies
7
Advertisement Number
TBRL/JRF/01/2023
Location of Posting/Admission
Ambala District, Haryana, India, 133101
Exam
CSIR NET, GATE, UGC NET
Post Type
Contractual
Department/Subject
Computer Science, Mechanical Engineering, Electronics and Communication Engineering, Physic
Salary
31000
Interview
Yes
Age Relaxation Type
SC/ST, Other Backward Class
Organisation Type
Non-Educational Institution
Website
https://www.drdo.gov.in/labs-and-establishments/terminal-ballistics-research-laboratory-tbrl
Place of Posting/Admission
Ramgarh, Haryana 134116, India

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी की गई पोस्ट्स

1. Junior Research Fellow

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

Terminal Ballistics Research Laboratory has released a notification for the Junior Research Fellow post. Interested candidates can apply from 25/04/2023 to 28/04/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Terminal Ballistics Research Laboratory invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name:

  1. Junior Research Fellow (Computer Science)

  2. Junior Research Fellow (Mechanical Engineering)

  3. Junior Research Fellow (Electronics and Communication Engineering)

  4. Junior Research Fellow (Physics)

Place of Interview: Terminal Ballistics Research Lab (TBRL), Sector 30 Chandigarh

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.