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  • Project Associate-I and 2 Other Post in CSIR Advanced Materials And Process Research Institute via Walk in Interview

    इवेंट की स्थिति : Created Event

घटनाक्रम

महत्वपूर्ण तिथियाँ

Application Opening Date
15/09/2022
Application Closing Date
15/09/2022
Date of Interview
15/09/2022

अन्य महत्वपूर्ण जानकारी

Appointment Type
Walk-In-Interview, Examination
Application Submission Method
Offline
Age Limit
18-50
Qualification Required
Graduate, Doctorate, Postgraduate
Total Vacancies
4
Advertisement Number
PROJ-4/2022
Location of Posting/Admission
Bhopal District, Madhya Pradesh, India, 322211
Exam
CSIR NET, GATE, UGC NET
Website
https://ampri.res.in/
Organisation Type
Educational Institution
Post Type
Contractual
Interview
Yes
Age Relaxation Type
SC/ST, Person with Benchmark Disabilities, Other Backward Class
Work Experience
Yes
Place of Posting/Admission
Bhopal, Madhya Pradesh, India
Salary
25000, 18000, 49000, 31000
Event Category
Education, PSUs

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी की गई पोस्ट्स

1. Project Associate-I
2. Scientific administrative assistant
3. Principal Project Associate

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

CSIR Advanced Materials And Process Research Institute has released job notifications for 3 posts, including Project Associate-I, Scientific administrative assistant, and others. Interested candidates can apply from 15/09/2022 to 15/09/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

CSIR Advanced Materials And Process Research Institute invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name :

(1) Project Associate-I

(2) Scientific Administrative Assistant

(3) Principal Project Associate

Place of Interview : CSIR-AMPRI, Bhopal.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.