Executive (SIIS-Operation) and 1 Post in NTPC Limited via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 16/11/2023 |
Application Opening Date | 02/11/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Postgraduate, Graduate |
Total Vacancies | 4 |
Application Fee | Yes |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Work Experience | Yes |
Organisation Type | Non-Educational Institution |
Website | https://www.ntpc.co.in/ |
Place of Posting/Admission | New Delhi, Delhi, India |
Age Relaxation Type | Economically Weaker Section, Other Backward Class, SC/ST, Person with Benchmark Disabilities, Ex-Servicemen |
Salary | 100000 |
Application Link | https://www.ntpc.co.in/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Thermal Power Corporation Limited invites applications for the following posts via direct recruitment:
Post Name:Executive (SIIS-Operation)
Essential Qualification:BE/B Tech with at least 60% marks from recognized University/ Institution.
Essential Work Experience: Minimum 02 years of post-qualification experience in control room of a power station or central control room of a power company of minimum 1000 MW installed capacity
Post Name: Executive (SIIS-Technology)
Essential Qualification:BE/B Tech/BSc/M-Tech in Computer Science/IT/Electronics or MCA with at least 60% marks from recognized University/Institution
Essential Work Experience: Minimum 02 years of post-qualification experience in the area of SQL Server, SAP, OSISoft PI, C#, Python and Web report development. Candidates having experience in power generation/industry will be preferred.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.