Chief Engineer and 3 Other Post in Delhi University via Direct Recruitment
इवेंट की स्थिति : Created Event
घटनाक्रम
महत्वपूर्ण तिथियाँ
Exam Date | 20/11/2024, 21/11/2024 |
Application Closing Date | 25/06/2024 |
Application Opening Date | 05/06/2024 |
अन्य महत्वपूर्ण जानकारी
Appointment Type | Direct Recruitment, Examination |
Application Submission Method | Online |
Age Limit | 18-45 |
Qualification Required | Graduate |
Total Vacancies | 11 |
Advertisement Number | R&P/302/2024 |
Application Fee | Yes |
Location of Posting/Admission | South East Delhi District, Delhi, India, 110020 |
Quota/Reservation | Scheduled Tribes, Scheduled Castes, Other Backward Classes, PWBD Quota |
Work Experience | Yes |
Website | http://www.du.ac.in/ |
Place of Posting/Admission | New Dehli, Delhi, India |
Organisation Type | Educational Institution |
Pay Matrix | Level 10, Grade Pay 5400, Level 11, Grade Pay 6600, Level 7, Grade Pay 4600, Level 6, Grade Pay 4200 |
Salary | 102501, 121641, 79053, 63378 |
Interview | Yes |
Post Type | Contractual |
नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।
जारी की गई पोस्ट्स
1. Chief Engineer
2. Executive Engineer
3. Assistant Engineer
4. Junior Engineer
महत्वपूर्ण अपडेट
अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।
Mains Update
एप्लीकेशन सारांश
Delhi University has released job notifications for 4 posts, including Chief Engineer, Executive Engineer, and others. Interested candidates can apply from 05/06/2024 to 25/06/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.
Delhi University invites applications for Chief Engineer P and various posts.
Application Process:
To apply, kindly fill out the provided application form with the necessary documents on to the Official Website:
Last Date for Application: 25/06/2024
Mode of Application:Online
For more details related to eligibility criteria, fee, pattern, annexures, place of posting, etc. refer to the given details and attachments below.