
Director post in Ropeway and Rapid Transport System Development Corporation Himachal Pradesh Limited via direct recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 30/11/2021 |
Application Opening Date | 06/11/2021 |
Other Important Information
Appointment Type | Direct Recruitment, Examination |
Application Submission Method | Offline |
Examination Mode | Offline |
Age Limit | 45-60 |
Qualification Required | Graduate |
Total Vacancies | 1 |
Advertisement Number | RTDC/Service Committee/2021/7577 |
Location of Posting/Admission | Shimla District, Himachal Pradesh, India, 172022 |
Exam | RTDC HP Ltd Rectt Test |
Website | http://www.rtdchp.org |
Organisation Type | Non-Educational Institution |
Place of Posting/Admission | Shimla, Himachal Pradesh, India |
Pay Matrix | Level 14, Grade Pay 10000 |
Post Type | Contractual |
Work Experience | Yes |
Interview | Yes |
Examination Centre | Regional |
Salary | 247866 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Ropeway and Rapid Transport System Development Corporation Himachal Pradesh Limited invites applications for the following post(s) via direct recruitment:
Post Name: Director
Essential Qualification: Graduate in Mechanical Engineering (B.E./B.Tech.) with good academic record from a recognized university/institution.
Essential Work Experience: The applicant must have an experience of 25 years with at least 10 years of experience in planning, construction, execution, contract management and regulation of Ropeway projects on EPC & PPP mode, Pre - Engineered structures.
Address to send the application: Candidate must fill in the application form and send it to Managing Director, Ropeways and Rapid Transport, System Development Corporation H.P. Ltd.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.