Exam Path Finder
Select Item
organisation_logo
  • PDTD Programme Through Entrance Exam in CITD for the Academic year 2023-24

    Event Status : Last Date Extended

Timeline

Important Dates

Application Closing Date
30/06/2023
Application Opening Date
03/04/2023

Other Important Information

Admission Bases
Course Admission
Application Submission Method
Offline
Examination Mode
Offline
Qualification Required
Diploma
Stream
Design, Engineering, Diploma Courses
Application Fee
Yes
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Exam
CITD Post Diploma Tool Design
Educational Credential Awarded
Diploma
Website
https://www.citdindia.org/
Place of Posting/Admission
Hyderabad, Telangana, India
Organisation Type
Educational Institution
Age Limit
18-27
Age Relaxation Type
SC/ST
Examination Centre
Regional
Application Link
https://www.citdindia.org/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Post Diploma In Tool Design

Important Updates

Refer to the official notification for more details.

Application Summary

Central Institute of Tool Design Hyderabad has released a notification for the Post Diploma In Tool Design program. Interested candidates can apply from 03/04/2023 to 30/06/2023. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

Central Institute of Tool Design Hyderabad invites online applications from eligible candidates for admission in PDTD programme. The important details of the admission process are listed below -

Course name: Post Diploma in Tool Design

Educational Qualification: Diploma in Mechanical Engineering or Equivalent

Address to send the application: The Candidate must fill in the application form and send it to The Principal Director, CITD, Balanagar, Hyderabad-500037 along with relevant documents.

For more details related to eligibility criteria, syllabus, fee, pattern, annexures, etc refer to the attachments below.