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  • PG Programme in Indian Institute of Packaging for the Academic Year 2024

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
10/07/2024
Application Opening Date
01/03/2024

Other Important Information

Admission Bases
Course Admission
Application Submission Method
Online
Examination Mode
Offline
Qualification Required
Graduate
Stream
Arts, Science, Others
Application Fee
Yes
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Educational Credential Awarded
Degree, Diploma
Place of Posting/Admission
Hyderabad, Telangana, India
Website
https://www.iip-in.com/
Organisation Type
Non-Educational Institution
Age Limit
18-30
Age Relaxation Type
SC/ST, Other Backward Class
Interview
Yes
Examination Centre
All India
Application Link
https://iip-in.com/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Postgraduate Diploma in Packaging
2. Master in Packaging Technology
3. Certified Packaging Engineer

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Packaging has released admission notifications for 3 programs, including Postgraduate Diploma in Packaging, Master in Packaging Technology, and others. Interested candidates can apply from 01/03/2024 to 10/07/2024. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

Indian Institute of Packaging invites online applications from eligible candidates for admission in various programs. The important details of the admission process are listed below -

Application Process:

To apply, kindly fill out the provided application form with the necessary documents to the Official Website: 

Course Name: Postgraduate Programme

Last Date for Application: 10/07/2024

Mode of Application: Online

For more details related to eligibility criteria, syllabus, fee, pattern, annexures, etc refer to the attachments below.