
Junior Engineer (Civil) and 20 Other Post in DBATU via Walk-in-Interview
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 14/08/2023 |
Date of Interview | 10/08/2023, 11/08/2023, 14/08/2023 |
Application Opening Date | 10/08/2023 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Offline |
Qualification Required | Graduate, Diploma, Postgraduate, Matriculate |
Advertisement Number | DBATU/Estt/Adv./Adhoc/2023/2101 |
Application Fee | Yes |
Location of Posting/Admission | Raigad District, Maharashtra, India, 402126 |
Salary | 28000, 18000, 22000, 30000, 15000, 32000, 20000 |
Interview | Yes |
Place of Posting/Admission | Lonere, Maharashtra, India |
Work Experience | Yes |
Website | https://dbatu.ac.in/ |
Organisation Type | Educational Institution |
Post Type | Contractual |
Department/Subject | Civil, Electrical, Carpentry and Welder |
Quota/Reservation | Scheduled Castes, Scheduled Tribes, Other Backward Classes, PWBD Quota |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Dr Babasaheb Ambedkar Technological University invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name:
Junior Engineer (Civil)
Junior Engineer (Electrical)
Civil Supervisor
Electrical Supervisor
Software (ICT) Engineer
Garden Superintendent
Sport Instructor/Coach
Medical Officer
Nurse
Legal Advisor
Accountant
Public Relation Officer
Assistant Public Relation Officer
Workshop Instructor (Carpentry and Welder)
Hostel Clerk
Clerk-cum-Typist & Data entry Operator
Laboratory Assistant
Driver
Library Assistant
Library Trainee
Library Attendant
Place of Interview: Dr Babasaheb Ambedkar Technological University Vidyavihar Lonere Raigad 402103 Maharashtra
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.