
Junior Research fellow Post in NITT via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 11/12/2023 |
Application Opening Date | 24/11/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Offline |
Qualification Required | Postgraduate |
Total Vacancies | 1 |
Location of Posting/Admission | Tiruchirappalli District, Tamil Nadu, India, 621006 |
Exam | CSIR NET, GATE, UGC NET |
Website | https://www.nitt.edu/ |
Place of Posting/Admission | Tiruchirappalli, Tamil Nadu, India |
Organisation Type | Educational Institution |
Post Type | Contractual |
Work Experience | Yes |
Interview | Yes |
Salary | 31000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Technology Tiruchirappalli invites applications for the following post via direct recruitment :
Post Name : Junior Research fellow
Essential Qualification :
(1) Post graduate degree (MTech or MSC or MS in Metallurgical and Materials Science and Engineering, Chemical Engineering, Chemistry, Physics, Ceramics, Nanotechnology, and any relevant Material Engineering branches.
(2) Valid GATE/ NET score is required as for the SERB guidelines. Incase if no candidates are found with GATE/NET score other candidates will be considered as per SERB guidelines SB/S9/Z-07/2020
Essential Work Experience : Work experience in electrospinning, material synthesis and characterization are preferrable.
Address to send the application: The Candidate must fill in the application form and send it to Dr. Illa Mani Pujitha, Assistant Professor, Department of Metallurgical and Materials Engineering, National Institute of Technology, Tiruchirappalli-15, Tamil Nadu along with relevant documents.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.