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  • Senior Executive and other post in National Thermal Power Corporation Limited

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
08/12/2021
Application Opening Date
24/11/2021

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Age Limit
18-55
Qualification Required
Postgraduate, Diploma, Graduate
Total Vacancies
3
Application Fee
Yes
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Website
www.ntpc.co.in
Place of Posting/Admission
New Delhi, Delhi, India
Organisation Type
Non-Educational Institution
Salary
71000
Work Experience
Yes
Age Relaxation Type
SC/ST, Other Backward Class, Person with Benchmark Disabilities, Jammu and Kashmir Domicile, Ex-Servicemen
Department/Subject
Corporate Communication, IT Developer
Post Type
Contractual

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Senior Executive
2. Executive

Important Updates

Refer to the official notification for more details.

Application Summary

National Thermal Power Corporation Limited has released notifications for the Senior Executive and Executive posts. Interested candidates can apply from 24/11/2021 to 08/12/2021. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

National Thermal Power Corporation Limited invites applications for the following post(s) via direct recruitment:


Post Name: Senior Executive (Corporate Communication)

Essential Qualification: Post Graduate Degree or Post Graduate Diploma in Communication/Advertising and Communication Management/Public Relations/Mass Communication/Journalism from recognized university/institution


Post Name: Executive (IT Developer)

Essential Qualification: BE/B.Tech in CS/IT or MCA from a recognized University/Institute with at least 60% marks


For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.