
Assistant Professor (CSE & IT) and 3 other posts in IIIT Sonepat via direct recruitment
Event Status : Eligible Candidates List Released for Interview
Timeline
Important Dates
Date of Interview | 29/05/2023, 30/05/2023 |
Application Closing Date | 22/12/2021 |
Application Opening Date | 01/12/2021 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Offline |
Qualification Required | Doctorate, Graduate, Postgraduate |
Advertisement Number | IIITSNP/RECT/2021/03 |
Application Fee | Yes |
Location of Posting/Admission | Sonipat District, Haryana, India, 131024 |
Website | www.iiitsonepat.ac.in |
Organisation Type | Educational Institution |
Place of Posting/Admission | Sonepat, Haryana, India |
Department/Subject | Computer Science Engineering, Information Technology, Mathematic |
Pay Matrix | Level 10, Grade Pay 5400, Level 13A2 |
Quota/Reservation | Unreserved, Other Backward Classes, Scheduled Tribes, Economically Weaker Sections, Scheduled Castes, PWBD Quota |
Salary | 211300, 98200, 100000 |
Work Experience | Yes |
Post Type | Contractual |
Interview | Yes |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Information Technology, Sonepat invites applications for the following post(s) via direct recruitment:
Post Name:
Assistant Professor (Computer Science Engineering & IT)
Assistant Professor (Mathematics)
Associate Professor (Computer Science Engineering & IT)
Adjunct Faculty (Computer Science Engineering & IT)
Address to send the application: Candidate must fill in the application form and send it to The Director, Indian Institute of Information Technology, Sonepat, I-TEC, Techno park, Sonepat Campus, Plot #4-B, Rajiv Gandhi Education City, Rai, Sonepat- 131029, Haryana.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.