Project Assistant Post in IIT Bhilai via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 24/01/2023 |
Application Opening Date | 11/01/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Postgraduate, Diploma |
Total Vacancies | 1 |
Location of Posting/Admission | Durg District, Chhattisgarh, India, 490021 |
Work Experience | Yes |
Organisation Type | Educational Institution |
Place of Posting/Admission | Bhilai, Chhattisgarh, India |
Website | https://www.iitbhilai.ac.in/ |
Salary | 28000 |
Post Type | Contractual |
Interview | Yes |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Technology Bhilai invites applications for the following posts via direct recruitment:
Post Name: Project Assistant
Essential Qualification:
MSc (Chemistry/Nanotechnology/Nano science) OR
MTech (Chemistry Engineer/ Materials Science Engineer) OR
MTech/MS in Nanotechnology/Materials Science Engineer from a recognized institute/university or
Statutory body or Science Graduate/ Diploma in Engineering of 3 years duration with minimum TWO years of experience in relevant area
Desirable: Preference will be given to candidates with work experience relevant to the project. Candidates with expertise in the following are strongly encouraged to apply:
Solution based synthesis of inorganic oxides nano structures, porous nano materials
Synthesis, characterization and processing of polymers and inorganic/organic hybrid materials
Expertise in different analytical techniques, including but not limited to Glove Box, ICP-OES, and MALDI TOF MS.
Application send via email to sanjib.banerjee@iitbhilai.ac.in
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.