Junior Research Fellow and 1 Other post in Defence Metallurgical Research Laboratory via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 24/07/2022 |
Application Opening Date | 21/06/2022 |
Other Important Information
Appointment Type | Direct Recruitment, Research Fellowship, Examination |
Application Submission Method | Online |
Age Limit | 18-27 |
Qualification Required | Graduate, Postgraduate, Doctorate |
Total Vacancies | 16 |
Advertisement Number | DMRL/HRD/JRF/06/2022/01 |
Location of Posting/Admission | Hyderabad District, Telangana, India, 500028 |
Exam | CSIR NET, GATE, UGC NET |
Place of Posting/Admission | Hyderabad, Telangana, India |
Organisation Type | Non-Educational Institution |
Website | https://www.drdo.gov.in/labs-and-establishments/defence-metallurgical-research-laboratory-dmrl |
Department/Subject | Metallurgy, Material Science, Physic, Chemistry, Mechanical |
Post Type | Contractual |
Salary | 31000, 54000 |
Interview | Yes |
Work Experience | Yes |
Age Relaxation Type | SC/ST, Other Backward Class |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Defence Metallurgical Research Laboratory invites applications for the following posts via direct recruitment:
Post Name: Junior Research Fellow
Essential Qualification: Graduation/Post graduation in relevant from a recognised University
Post Name: Research Associate
Essential Qualification:
(i) Ph.D. in Metallurgical Engineering/Material Science and engineering Or
(ii) ME/M. Tech in Metallurgical Engineering/Material Science and engineering with First Division along with 03 years research, teaching or design and development experience and at least one published
Application can be sent via email to dmrlhrd@gmail.com
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.