Exam Path Finder
Select Item
organisation_logo
  • Graduate Engineer Post in BIS via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
28/07/2023
Application Opening Date
08/07/2023

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Age Limit
18-35
Qualification Required
Postgraduate, Graduate, Diploma
Total Vacancies
4
Advertisement Number
01 (GE)/2023/DLBO-I
Location of Posting/Admission
Delhi, India, 110085
Work Experience
Yes
Place of Posting/Admission
Delhi, India
Website
https://www.bis.gov.in/
Organisation Type
Non-Educational Institution
Interview
Yes
Department/Subject
Electrical and Electronics Engineering, Functional testing in manufacturing, Multi-Chip Module
Application Link
https://docs.google.com/forms/d/e/1FAIpQLScpCeVzFzPkisf9PCrlVmtgOq3iiCuBdYw73fMaMrpyDBnExw/viewform

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Graduate Engineer

Important Updates

Refer to the official notification for more details.

Application Summary

Bureau of Indian Standards has released a notification for the Graduate Engineer post. Interested candidates can apply from 08/07/2023 to 28/07/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Bureau of Indian Standards invites applications for the following posts via direct recruitment:

Post Name: Graduate Engineers

Essential Qualification: Masters Degree in relevant subject or BE/B. Tech in EEE/ FCT/MCM with minimum 60% of marks in class-X, XII and in the qualifying degree

Desirable: 2 Years PG Diploma in Management or Persons with M.Phil, M.Tech. M.S., Ph.D, additional qualifications, research experience, published papers and post qualification experience in the relevant field would be preferred.

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.